This article offers an in-depth analysis of brand memory modules, including their characteristics, application scenarios, and comparisons among different brands.
2025-02-10
The article delves into the concept of memory performance, covering its significance, ways to evaluate it, common issues like memory leaks, and strategies for improvement.
2025-02-10
This article covers various aspects of desktop memory, from different types and their features to methods of upgrading and specific product offerings.
2025-02-10
The article offers a detailed analysis of laptop memory, covering different brands, capacities, and prices. It also highlights the features and customer reviews of various memory products.
2025-02-10
This article explores various aspects of server memory in SQL Server, such as its parameters, setting methods, and querying techniques to help users manage and optimize memory usage.
2025-02-10
This article presents a detailed examination of multiple SSD reviews, highlighting their features, performance, and user experiences
2025-02-10
This article explores the recent changes and future expectations of SSD prices, covering various factors influencing the market.
2025-02-10
The article introduces SSD Benchmarks, focusing on the AS SSD Benchmark tool, its functions, test parameters, and significance in evaluating SSD performance.
2025-02-10
This article offers a comprehensive understanding of memory upgrade, including its significance, types, methods of checking memory, and related products.
2025-02-10
This guide offers step-by-step instructions for installing SSDs, including preparing tools, choosing the right SSD, and handling common problems. It also emphasizes the importance of proper installati
2025-02-10
The article explores the relationship between DDR memory and other types of memory, highlighting its advantages, and discussing its impact on computer systems and storage devices.
2025-02-10
The article explores various aspects of SSD compatibility, including issues with Dell laptops, second SSD installation in Dell and ASUSTOR devices, and solutions for compatibility problems in differen
2025-02-10
This article explores the concept of high-speed memory, covering various aspects such as its types, applications in different devices, and the latest technological developments in this field.
2025-02-10
The article explores the top SSD brands, their market shares, and the factors influencing their performance
2025-02-10
The article explores the differences and similarities between HBM and various other memory types, highlighting their performance, cost, and usage in different fields.
2025-02-10
The article explores the various aspects of HBM's future development, including its market size, application expansion, technological advancements, and competitive landscape.
2025-02-10
This article delves into various aspects of SSD capacity, covering details such as maximum installable capacity, capacity conversion, and more
2025-02-10
This article provides a comprehensive understanding of memory storage, including its types, functions, and differences in computer systems.
2025-02-10
The article discusses the disadvantages of HBM, including information from various sources
2025-02-10
This article examines the significant advantages of HBM technology in terms of bandwidth, power consumption, packaging size, and its potential as a mainstream solution.
2025-02-10
This article explores HBM in computing, including its definition, how it works, its role in AI servers, market growth, and future prospects.
2025-02-10
The article explores the features, applications, market trends, and differences of HBM technologies, covering aspects such as performance, manufacturing, and market share
2025-02-10
The article discusses SSD performance in detail, including performance test procedures, important concepts, and reasons for performance changes. It also mentions different SSD brands and their charact
2025-02-10
This article provides an in-depth analysis of the HBM market, covering its historical trends, current status, major players, application areas, challenges, and future projections
2025-02-10
Memory chips play a crucial role in digital economy. This article discusses their structure, performance evaluation, and the latest restrictions on their export.
2025-02-10
The article delves into HBM performance, including its issues in IEC-robust ICs, custom forms by Samsung Electronics, advancements driven by AI, features of HBM3, and future plans for HBM4.
2025-02-10
The article explores various aspects of memory modules, including their definitions, types, functions, and examples of different models.
2025-02-10
The article delves into the various aspects of Solid State Drive, comparing it with other types of drives and highlighting its significance in modern computing.
2025-02-10
The article delves into the concept of memory capacity, covering its definition, types, factors affecting it, and its significance in the field of technology
2025-02-10
This article provides a comprehensive understanding of the memory interface, covering its components, functions, and applications in different scenarios such as memory chips and microcontrollers.
2025-02-10
The article offers a comprehensive overview of HBM technology, including its application in mining, advancements in the semiconductor industry, and its growing demand in the market.
2025-02-10
This article explores the nature, workings, and benefits of SSDs compared to HDDs. It also offers tips on choosing SSDs and recommends some popular models.
2025-02-10
This article delves into the various aspects of memory access, including its definition, functions in different systems, and importance in computing.
2025-02-10
The article delves into various memory types, including private, shared, anonymous, and file-backed with swap. It explains their properties and applications in detail.
2025-02-10
This article offers detailed information about memory devices, including their components, working principles, and various types such as SRAM, DRAM, and ROM. It also discusses their applications in di
2025-02-10
The article examines the diverse uses and technological aspects of High Bandwidth Memory (HBM), including its circuit design, engineering services, package integration, and access with FPGAs.
2025-02-10
The article covers various aspects of memory management, from its basic requirements and methods to addressing issues like blue screens and memory leaks.
2025-02-10
This article delves into various aspects of memory performance, including its assessment parameters, common causes of memory leaks, and ways to optimize it.
2025-02-10
The article discusses memory optimization techniques including software for monitoring CPU and RAM, register variable allocation in C language, subgraph partitioning, and buffer reuse, among others.
2025-02-10
This comprehensive guide covers the causes of high memory usage, methods to check memory usage, strategies for optimization, and introduces several effective memory optimization tools.
2025-02-10
The article discusses different approaches and resources related to memory improvement, including music, exercises, and proven techniques.
2025-02-10
This article covers HBM's applications in test measurement, industrial control, and the semiconductor industry, as well as its technical features and advantages.
2025-02-10
The article discusses the importance of effective memory retention and presents research findings and practical methods for enhancing it. It covers topics such as the role of sleep and different study
2025-02-10
This article provides in-depth insights into the concept of memory storage, differentiates between memory and storage, and explains their roles in computer systems.
2025-02-10
The article delves into the complex world of memory disorders treatment, offering comprehensive information and potential solutions.
2025-02-10
The article discusses multiple aspects of memory loss prevention, including age-related changes, scientific research findings, and practical tips for keeping the brain in good shape.
2025-02-10
The article examines different methods and systems for evaluating memory performance, including those using body sensors, benchmarks for multicore processors, and comparisons between Hadoop and Spark.
2025-02-10
This article provides comprehensive information on memory capacity expansion, including techniques using memory chips and circuits in data processing systems.
2025-02-10
This article delves into the diverse aspects of memory technology, covering its applications, advancements, and related components
2025-02-10
The article discusses the causes and effectiveness of memory training programs in different contexts, such as Alzheimer’s disease and dementia, and examines their impact on working memory.
2025-02-10
The article delves into the nature of optimal memory strategies, their role in cognitive functions, and how they are utilized in AI and learning. It also provides tips for enhancing memory.
2025-02-10
The article covers memory optimization methods including software for monitoring CPU and RAM changes, register variable allocation in C language, and various optimization techniques in computing graph
2025-02-10
The article delves into the concept of memory capacity, covering its definitions, related terms, influencing factors, and applications in different fields.
2025-02-10
The article presents multiple proven memory improvement techniques, covering aspects such as the Memory Palace, short-term and long-term memory, and practical activities.
2025-02-10
The article discusses the importance of memory upgrade for enhancing computer performance, different types of updates, and various ways to check memory details and usage.
2025-02-10
The article covers various aspects of memory management, such as its requirements, virtual memory systems, application-level management, causes of issues like blue screen, and solutions.
2025-02-10
The article emphasizes the crucial role of memory speed in enhancing computer performance, discusses factors affecting it, and offers practical solutions for improvement.
2025-02-10
The article presents diverse aspects of memory enhancement, including music, capsules, and language expressions, along with their associated benefits and features.
2025-02-10
The article delves into the significance of memory chips in the digital economy, discusses different types and how to assess their performance, and examines the latest developments in chip restriction
2025-02-10
This article delves into the crucial aspects of memory performance in computer systems, covering its components, evaluation metrics, and optimization techniques.
2025-02-10
The article covers various aspects of memory types, including their classification, features, and usage in different systems.
2025-02-10
The article discusses different memory solutions from various companies, covering their features, performance, and availability.
2025-02-10
The article explores the concept of memory expansion, including different methods and its significance in improving computer performance.
2025-02-10
The article explores various aspects of memory devices, including their structure, operation, and electrical characteristics. It also mentions their use in different systems and devices.
2025-02-10
The article explores the concept of embedded memory, discusses its role in different systems like ESP32-CAM and STM32, and examines various boot modes and memory characteristics.
2025-02-10
This article provides a comprehensive understanding of memory storage, including its types, features, and differences between related terms
2025-02-10
The article delves into the definition, types, influencing factors, and applications of memory capacity, offering valuable insights for readers.
2025-02-10
The article explores the concept of memory speed, offers methods to check it on different operating systems, and discusses ways to enhance it for improved system performance.
2025-02-10
This article explores the various aspects of solid-state memory, from its basic definition and types to its wide range of applications and the continuous advancements in the field.
2025-02-10
This article explains the evolution of DDR memory from SDRAM, describes its various types and their characteristics, and offers guidance on how to select the right DDR memory for different needs.
2025-02-10
The article delves into various aspects of high-performance memory, including its intrinsic mechanisms, role in different systems, and recent advancements like CXL and GDDR6.
2025-02-10
The article discusses the importance of memory upgrade for improving computer performance, different types of updates, and how to check memory details on different operating systems.
2025-02-10
This article delves into the various aspects of memory storage, including its types, functions, and differences in computer systems.
2025-02-10
This article provides detailed information about the memory module, including its structure, working principle, and various related aspects.
2025-02-10
This article offers a comprehensive exploration of memory chips, including their structure, types, application scenarios, as well as the latest industry developments and regulatory measures.
2025-02-10
The article delves into the world of memory cards, explaining their functionality, uses in different electronics, and factors to consider when choosing one.
2025-02-10
The article delves into the applications of Magnetoresistive Random-Access Memory (MRAM) in multiple industries. It highlights how MRAM meets the specific requirements of each application, such as hig
2025-02-07
The article explores NETSOL's Asynchronous SRAM, including its key features like broad density, power supply flexibility, and ECC support. It also details the product range with different densities, a
2025-02-07
Netsol offers KGD products in wafer form. These products simplify system design and reduce device dimensions. They have equivalent quality and performance to discrete products. All SRAM products are a
2025-02-07
The article focuses on Netsol's Wafer Biz, highlighting its KGD products. These products are in wafer form and offer advantages to chipset vendors for SiP solutions. They have equivalent quality to di
2025-02-07
NETSOL's Parallel STT - MRAM products are ideal for applications needing quick and frequent data storage and retrieval. They possess features like non - volatility, high endurance, and fast - write ca
2025-02-07
The article delves into NETSOL's Serial STT - MRAM products. It first explains the advantages of STT - MRAM technology. Then, it details the product lineup with different densities, including their fe
2025-02-07
The industrial and automotive grade LPDDR5/5X offers capacity coverage from 4GB to 8GB in a 315-ball standard FBGA packaging. It has features like high bandwidth, low power consumption, high reliabili
2025-02-07
The article focuses on a UFS product with a self - developed UFS 2.2 controller chip, LDPC 3.0 ECC error - correction engine, and large capacity. It details the product parameters, characteristics lik
2025-02-07
The Industrial and Automotive Grade eMMC is compatible with JEDEC eMMC5.1, has self-developed components, and offers a range of specifications. It features high reliability, durability, and more. It f
2025-02-07
The industrial and automotive grade LPDDR4/4X offers a wide capacity range, high performance, and various features like high reliability and wide temperature tolerance. It has multiple models with dif
2025-02-07
The article focuses on eMMC products that are compatible with JEDEC eMMC5.1, have self-developed controllers and firmware, offer various capacities, and are highly compatible with mainstream platforms
2025-02-07
The article delves into the remarkable features of LPDDR4/4X, including high data transmission rates, low power consumption, and more. It also examines its diverse application areas, such as mobile de
2025-02-07
The article delves into Jingcun's SSD products. It first introduces the concept of SSDs and how Jingcun uses 3D NAND technology. Then it details various SSD product lines, their features and performan
2025-02-07
The article delves into DRAM memory modules, discussing the characteristics of DDR5 and DDR4 modules, such as their frequencies and voltage requirements. It also elaborates on the product line's multi
2025-02-07
The article focuses on Jingcun's consumer - grade embedded storage. It first introduces the various products in the series such as DRAM and flash products. Then, it elaborates on the product line adva
2025-02-07
The article reports on the widespread adoption of DeepSeek by 20 global tech companies. International giants like AMD, Microsoft, etc. and numerous domestic enterprises have all incorporated DeepSeek
2025-02-07
DeepSeek's low - cost AI model expands AI application scenarios, increasing data center construction. This drives the demand for optical transceiver modules, with shipments expected to grow significan
2025-02-07
The article discusses how DeepSeek's new models are influencing the AI industry. It mentions the growth of the AI Server market, the challenges of cost and efficiency in the AI industry, and how DeepS
2025-02-07
The article focuses on DeepSeek's login methods which include various options such as phone number and WeChat login. It emphasizes the importance of users agreeing to the Terms of Use and Privacy Poli
2025-02-07
The article explores the recent trends in the global semiconductor and related industries. It covers price movements, major investments like SK Hynix's large-scale investment in HBM, technological bre
2025-02-07
The article details the price fluctuations, demand status, and market dynamics in the storage spot market. It shows that prices of SSDs and memory modules have been declining, demand remains weak, and
2025-02-07
The article comprehensively explores different elements within the domain of integrated circuits. It explains the functions and significance of various components and concepts, highlighting their role
2025-02-07
The article focuses on the semiconductor market in 2025. It first notes the ongoing merger and acquisition trend. Then it delves into various areas like IC design, the rise of DeepSeek in the AI chip
2025-02-07
The article explores the technology market in 2025. It examines how DeepSeek's AI models are driving optical communication demand, the strategies of NAND Flash and DRAM manufacturers in the face of ma
2025-02-07
The article focuses on the semiconductor industry's weekly hotspots. It covers government investment in Yizhuang, new developments of semiconductor manufacturers like Huahong Group, market research re
2025-02-07
The article delves into various significant events in the AI and chip landscape, such as SoftBank's potential acquisition, DeepSeek's global integration, Yixing Intelligence's financing, and more. It
2025-02-07
The article explores recent happenings in the memory industry, including advancements in 3D NAND etching, corporate product launches and performance, new industry opportunities like MRAM project compl
2025-02-07
The article covers recent developments in the memory industry, such as technological improvements, corporate performance reports, new product introductions, and industry expansion opportunities. It hi
2025-02-07
The Market Trends and Sales Opportunities of Semiconductor Storage Chips in the Era of DeepSeekIntroductionThe semiconductor industry has witnessed significant developments in recent times, especia...
2025-02-07
好的,我现在要分析用户的问题,关于2025年内存半导体行情趋势以及作为销售人员如何应对。首先得仔细看看用户提供的搜索结果,里面有很多网页内容,需要从中提取关键信息。首先,用户的问题分两部分:行情趋势分析和销售人员的应对策略。我需要先总结趋势,再给出建议。从搜索结果来看,多个网页提到了DRAM和NAND的价格波动,尤其是DRAM在2025年上半年可能继续下跌,而HBM需求增长很快。网页1提到D...
2025-02-07
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPWEB TECHNOLOGYCAPACITYCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPMT35XU512ABA1G12-0SIT1COMPONENTNOXccela Flash512Mb512Mb200MHz400MTPS1.8V-40C to +...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEPROTOCOLOPERATING TEMPPIN COUNTMT29VZZZBD81SLSL-046 W.22D1COMPONENTNO560GbNSRNSR1.1VUFS2.2-25C to +85C254-ballMT30AZZ...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSMODULE VERSIONPART TYPEPLPDENSITYMODULE DENSITYCOMPONENT DENSITYSPEEDINDUSTRY SPEEDMT/SMTA8ATF1G64AZ-3G2E18UDIMMMODULENO8GB8GB8GB1600MHzPC4-32003200MTPSMTC4C10163S1UC...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCAPACITYCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPMT25TL512BBA8ESF-0AAT2COMPONENTNO512Mb512Mb133MHz160MTPS3V-40C to +105CMT25TL01GHBB8E12-0AAT2CO...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPWEB TECHNOLOGYCAPACITYCOMPONENT DENSITYI/O VOLTAGEOPERATING TEMPBUS WIDTHMT29F512G08EBHAFB17A3WC1-F1DIENO3D NAND512Gb512Gb1.2V0C to +70Cx8MT29F256G08EBHBF...
2024-09-29
PART NUMBERPART TYPEPLPCAPACITYI/O VOLTAGEOPERATING TEMPBUS WIDTHPIN COUNTPART STATUS CODECOMPONENT CONFIGMT29F8G08ADAFAWP-AAT:FCOMPONENTNO8Gb3.3V-40C to +105Cx848-pinContact Factory1G x8MT29F2G08A...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCAPACITYCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHPART STATUS CODECOMPONENT CONFIGMT25QU512ABB8ESF-0SIT1COMPONENTNO512Mb512Mb166MHz166MT...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHCAS LATENCYPIN COUNTMT48LC16M16A2B4-6A:G1COMPONENTNO256Mb166MHz332MTPS3.3V0C to +70Cx16CL = 35...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSMODULE VERSIONPART TYPEPLPDENSITYMODULE DENSITYCOMPONENT DENSITYSPEEDINDUSTRY SPEEDMT/SMTA36ASF4G72PZ-2G6E136RDIMMMODULENO32GB32GB32GB1333MHzPC4-26662666MTPSMTC20F208...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCAPACITYCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHPIN COUNTMT29F8T08GULDHD5-M:D8COMPONENTNO8Tb8TbNSRMHzNSRMTPS1.2V70Cx8154-ballMT29F1T08...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCAPACITYCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHMT28EW256ABA1LPC-0SIT1COMPONENTYES256Mb256MbNSRMHzNSRMTPS3V-40C to +85Cx16MT28EW512ABA...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPPIN COUNTMT29GZ5A5BPGGA-046AAT.87J1COMPONENTNO8Gb2133MHz4266MTPS1.8V-40C to +105C149-ballMT29C4G48MAZBB...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSMODULE VERSIONPART TYPEPLPDENSITYMODULE DENSITYCOMPONENT DENSITYMT/SMTC40F2047S1HC88XB140MRDIMMMODULENO128GB128GB128GB8800MTPSMTC40F204WS1HC88XC140MRDIMMMODULENO96GB9...
2024-09-29
PART NUMBERPART TYPEPLPCAPACITYI/O VOLTAGEOPERATING TEMPBUS WIDTHPART STATUS CODECOMPONENT CONFIGMT29F32G08CBACAL73A3WC1LDIENO32Gb3.3V0C to +70Cx8Contact Factory4G x8MT29F512G08CMCEBJ4-37ITR:ECOMPO...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSMODULE VERSIONPART TYPEPLPDENSITYMODULE DENSITYCOMPONENT DENSITYSPEEDINDUSTRY SPEEDMT/SMTA72ASS8G72LZ-3G2R272LRDIMMMODULENO64GB64GB64GB1600MHzPC4-32003200MTPSMTA36ASF...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHCAS LATENCYPIN COUNTMT62F768M64D4EK-023 FAAT:B4COMPONENTNO48Gb4266MHz8533MTPS0.5V-40C to +105C...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHCAS LATENCYPIN COUNTMT62F3G32D8DV-026 AAT:B8COMPONENTNO98Gb3750MHz7500MTPS0.5V-40C to +105Cx32...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHCAS LATENCYPIN COUNTMT53E1536M64D8HJ-046 AIT:B8COMPONENTNO96Gb2133MHz4266MTPS1.1V-40C to +95Cx...
2024-09-29
PART NUMBERPART TYPECOMPONENT DENSITYMT/SI/O VOLTAGEBUS WIDTHPIN COUNTMT68A512M32DF-32:ACOMPONENT16Gb32GTPS1.2Vx32266-ballMT68A512M32DF-28:ACOMPONENT16Gb28GTPS1.2Vx32266-ball
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHPIN COUNTMT61K512M32KPA-24:U2COMPONENTNO16Gb3GHz24GTPS1.35V95Cx32180-ballMT61K512M32KPA-21:U2C...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHPIN COUNTMT61K512M32KPA-16:C2COMPONENTNO16Gb2GHz16GTPS1.35V0C to +95Cx32180-ballMT61K512M32KPA...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPPIN COUNTMT29GZ6A6BPIET-046IT.1121COMPONENTNO16Gb2133MHz4266MTPS1.8V-40C to +85C149-ballMT29VZZZCD9GUKP...
2024-09-29
PART NUMBERPART TYPEPLPCAPACITYI/O VOLTAGEPROTOCOLOPERATING TEMPPIN COUNTMTFC256GBCAQTC-AATCOMPONENTNO256GB1.8VMMC5.1-40C to +105C153-ballMTFC32GBCAQTC-AATCOMPONENTNO32GB1.2V-40C to +105C153-ballMT...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHCAS LATENCYPIN COUNTMT46V16M16CY-5B IT:M1COMPONENTNO256Mb200MHz400MTPS2.5V-40C to +85Cx16CL = ...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHCAS LATENCYPIN COUNTMT40A2G4SA-062E:R1COMPONENTNO8Gb1600MHz3200MTPS1.2V0C to +95Cx4CL = 2278-b...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHCAS LATENCYPIN COUNTMT41K64M16TW-107 AAT:J1COMPONENTYES1Gb933MHz1866MTPS1.35V-40C to +105Cx16C...
2024-09-29
PART NUMBERNUMBER OF COMPONENTSPART TYPEPLPCOMPONENT DENSITYSPEEDMT/SI/O VOLTAGEOPERATING TEMPBUS WIDTHCAS LATENCYPIN COUNTPART STATUS CODECOMPONENT CONFIGPACKAGEMT47H64M16NF-25E IT:M1COMPONENTNO1G...
2024-09-29
In recent years, we have seen considerable growth in artificial intelligence(AI) models for natural language processing (NLP), largely due to theremarkable performance of large language models (LLM...
2024-08-31
Micron HBM3E 8-high 24GB will ship in NVIDIA H200 Tensor Core GPUs starting in the second calendar quarter 2024. Micron HBM3E 12-high 36GB samples are available now.
2024-08-31
Micron’s HBM3E 8-high 24GB and HBM3E 12-high 36GB deliver industry-leading performance with bandwidth greater than 1.2 TB/s and consume 30% less power than any other competitor in the market.
2024-08-31
Part No.Memory ConfigurationDensityDensity unitSTR Frequency (MHz)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitInterface TypeW25M321AVEIT32Mb NOR+1Gb NAND1Gb104-4085SON88X6...
2024-08-23
Part No.DensityDensity unitTemp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitI/OInterface TypeW29N01HVBANA1Gb-40105VFBGA639X11MM^28bitONFIW29N01HVBANF1Gb-40105VFBGA639X11MM^28bi...
2024-08-23
Part No.DensityDensity unitSTR Frequency (MHz)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitInterface TypeW25H01JVSFAM1Gb133-40105SOP16300MILSPI/Dual/QuadW25H01JVSFSM1Gb133-...
2024-08-23
Part No.DensityDensity unitFrequency (Mbps)Voltage (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitI/OW9812G2KB-6128Mb1663.3070TFBGA908X13MM^232bitW9812G2KB-6I128Mb1663.3-4...
2024-08-23
Part No.DensityDensity unitSTR Frequency (MHz)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitInterface TypeW25M02GVSFAG2Gb104-40105SOP16300MILSPI/Dual/QuadW25M02GVSFAT2Gb104-...
2024-08-23
Part No.DensityDensity unitSTR Frequency (MHz)DTR Frequency (MHz)Voltage (min) (V)Voltage (max) (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitInterface TypeW35N01JWTBAG1G...
2024-08-23
Part No.DensityDensity unitSTR Frequency (MHz)DTR Frequency (MHz)Voltage (min) (V)Voltage (max) (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitInterface TypeW35T01NWTBAE1G...
2024-08-23
Part No.DensityDensity unitFrequency (Mbps)Voltage (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitI/OW987D2HBJX6E128Mb1661.8/1.8-2585VFBGA908X13MM^232bitW987D2HBJX6I128Mb1...
2024-08-23
Part No.DensityDensity unitFrequency (Mbps)Voltage (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitI/OW66AP6NBHAFA1Gb32001.8/1.1/1.1-4095VFBGA10010X7.5MM^216bitW66AP6NBHAFI...
2024-08-23
Part No.DensityDensity unitFrequency (Mbps)Voltage (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitI/OW63AH2NBVABE1Gb16001.8/1.2/1.2-2585VFBGA17811X11.5MM^232bitW63AH2NBVAB...
2024-08-23
Part No.DensityDensity unitFrequency (Mbps)Voltage (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitI/OW978H2KBVA1A10661.8/1.2/1.2W978H2KBVA1K256Mb10661.8/1.2/1.2-40105VFBGA...
2024-08-23
Part No.DensityDensity unitFrequency (Mbps)Voltage (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitI/OW947D2HBJX5E128Mb4001.8/1.8-2585VFBGA908X13MM^232bitW947D2HBJX5I128Mb4...
2024-08-23
Part No.DensityDensity unitFrequency (Mbps)Voltage (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitI/OW955K8MBYA5A32Mb4001.8/1.8-4085TFBGA (5X5)246X8MM^28bitW955K8MBYA5I32M...
2024-08-23
Part No.DensityDensity unitFrequency (Mbps)Voltage (V)Package TypePINDimensionDimension unitI/OW664GG6RB-064Gb32001.2VFBGA967.5X13MM^216bitW664GG6RB-074Gb26661.2VFBGA967.5X13MM^216bitW664GG6RB-084G...
2024-08-23
Part No.DensityDensity unitFrequency (Mbps)Voltage (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitI/OW631GG6MB09A1Gb21331.5-4095VFBGA967.5X13MM^216bitW631GG6MB09K21331.5VF...
2024-08-23
Part No.DensityDensity unitFrequency (Mbps)Voltage (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitI/OW9712G6KB-25128Mb8001.8095TFBGA848X12.5MM^216bitW9712G6KB-3128Mb6671.8...
2024-08-23
Part No.DensityDensity unitFrequency (Mbps)Voltage (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitW9412G6JH-5K4002.5W9412G6KH-5128Mb4002.5070TSOPII66400MILW9412G6KH-5A128M...
2024-08-23
Part No.DensityDensity unitSTR Frequency (MHz)Voltage (min) (V)Voltage (max) (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitW25R01JVZHIQ1Gb1332.73.6-4085SON88X6MM^2W25R01N...
2024-08-23
Part No.DensityDensity unitSTR Frequency (MHz)Voltage (min) (V)Voltage (max) (V)Temp. (min) (⁰C)Temp. (max) (⁰C)Package TypePINDimensionDimension unitInterface TypeW25Q12NEBYIG128Mb1041.141.26-4085...
2024-08-23
eMCP LPDDR4XProduct NameDRAM DensityFlash DensityConfigSpeedPackageGradeTemperatureAvailabilityNE4888KAPAXAI-MF8Gb8GBytesx324267Mbps254-ball BGACommercial-25C~85CMPNE4888KAPAXAI-ME8Gb8GBytesx323733...
2024-08-23
eMCP LPDDR3Product NameDRAM DensityFlash DensityConfigSpeedPackageGradeTemperatureAvailabilityNE1888KALAXA7-MD8Gb8GBytesx321866Mbps221-ball BGACommercial-25C~85CMPNE1888KALAXA7-MG8Gb8GBytesx322133M...
2024-08-23
MCP LPDDR4XProduct NameDRAM DensityFlash DensityConfigSpeedPackageGradeTemperatureAvailabilityNM4484NSPAXAE-3E4Gb4Gbitsx163733Mbps149-ball BGACommercial-25C~85CMPNM4484NSPAXAE-3EE4Gb4Gbitsx163733Mb...
2024-08-23
MCP LPDDR2Product NameDRAM DensityFlash DensityConfigSpeedPackageGradeTemperatureAvailabilityNM1482KMLAXAL-3BI2Gb4Gbitsx321066Mbps162-ball BGAIndustrial-40C~105CMPNM1181NSLAXAJ-3BE1Gb1Gbitsx161066M...
2024-08-23
Product NameDRAM DensityConfigSpeedPackageGradeTemperatureAvailabilityNT6AP256T32AV-J18Gbx324267Mbps200-ball BGACommercial-30C~105CMPNT6AP256T32AV-J28Gbx323733Mbps200-ball BGACommercial-30C~105CMPN...
2024-08-23
Product NameDRAM DensityConfigSpeedPackageGradeTemperatureAvailabilityNT6AN256T32AV-J18Gbx324267Mbps200-ball BGACommercial-30C~105CMPNT6AN256T32AV-J28Gbx323733Mbps200-ball BGACommercial-30C~105CMPN...
2024-08-23
Product NameDRAM DensityConfigSpeedPackageGradeTemperatureAvailabilityNT6CL256M32AM-H18Gbx321866Mbps178-ball BGACommercial-30C~105CMPNT6CL256M32AM-H08Gbx322133Mbps178-ball BGACommercial-30C~105CMPN...
2024-08-23
DRAM DensityConfigSpeedPackageGradeTemperatureAvailabilityNT6TL64T32BA-G0H2Gbx321066Mbps134-ball BGAAutomotive-40C~105CMPNT6TL128T64BR-G0I8Gbx641066Mbps216-ball PoPIndustrial-40C~85CMPNT6TL256T32BQ...
2024-08-23
Product NameDRAM DensityConfigVoltageSpeedPackageGradeTemperatureAvailabilityNT5AD512M16C4-HR8Gbx161.2V2666Mbps96-ball BGACommercial0C~95CMPNT5AD512M16C4-JR8Gbx161.2V3200Mbps96-ball BGACommercial0C...
2024-08-23
Product NameDRAM DensityConfigVoltageSpeedPackageGradeTemperatureAvailabilityNT5CB256M8JQ-DI2Gbx81.5V1600Mbps78-ball BGACommercial0C~95CMPNT5CB256M8JQ-FL2Gbx81.5V2133Mbps78-ball BGACommercial0C~95C...
2024-08-23
DRAM DensityConfigVoltageSpeedPackageGradeTemperatureAvailabilityNT5TU128M8HE-BE1Gbx81.8V1066Mbps60-ball BGACommercial0C~95CMPNT5TU128M8HE-AC1Gbx81.8V800Mbps60-ball BGACommercial0C~95CMPNT5TU64M16H...
2024-08-23
At FMS 2024, Phison devoted significant booth space to their enterprise / datacenter SSD and PCIe retimer solutions, in addition to their consumer products. As a controller / silicon vendor, Phison...
2024-08-20
The CXL consortium has had a regular presence at FMS (which rechristened itself from 'Flash Memory Summit' to the 'Future of Memory and Storage' this year). Back at FMS 2022, the company had announ...
2024-08-20
When Western Digital introduced its Ultrastar DC SN861 SSDs earlier this year, the company did not disclose which controller it used for these drives, which made many observers presume that WD was ...
2024-08-20
2024-07-10
2024-07-10
2024-07-10
Memory innovator Netsol has announced a major leap in the memory technology with the development of a Flash-like MRAM.Following the successful release of STT-MRAM products earlier last year and suc...
2024-05-07
Netsol Unveils First Standalone MRAM Using 28nm Process, Shares the Outlook for Standalone MRAM at 2
At the 2023 MRAM Forum, a key event by the IEEE Magnetics Society tied to the IEDM conference, Mr. Noh, Chief Technology Officer at Netsol, provided an overview of the company's advancements in MRA...
2024-05-07
深圳市晶存科技有限公司是一家集设计、研发、封装、测试和销售于一体的存储芯片高新技术企业 公司拥有18年以上行业经验的核心团队,始终聚焦存储芯片产品致力于为客户提供高性价比的存储芯片以及存储解决方案,立志为中国存储产业发展做出杰出的贡献。 晶存自研工规级闪存控制器芯片,基于该芯片的eMMC模组产品已实现千万级的出货 控制器芯片及固件技术、模组芯片及量产封装测试技术得到了业内...
2024-04-26
We offer FPGAs Leadership Across Multiple Process Nodes | CPLDs offer High Performance and Ultra-low Power Consumption.Whether you are designing a state-of-the art, high-performance networking appl...
2024-04-23
8GB? 16GB? 32GB? 64GB? 128GB?!! We just can’t seem to get enough. With better cameras and displays – which mean more selfies, bigger pictures and more videos – memory has been a growing priority wh...
2024-03-29
DDR5 is short for “DDR-SDRAM 5” which means “Double Data Rate Synchronous Dynamic Random Access Memory generation 5”. It’s the fifth iteration of a RAM technology that uses both rising and descendi...
2024-03-29
LPDDR (Low Power Double Data Rate) RAM is a type of mobile DRAM (dynamic random-access memory) that is commonly used in smartphones, tablets, and other mobile devices. It is designed to be power-ef...
2024-03-29
ContentsRAM Flash memoryFor a smartphone, any component can affect the overall performance and experience of the phone, processor, memory, flash, screen, and more. However, for the novice users who...
2024-03-29
1. NAND FlashThe full name of NAND Flash is Flash Memory, which belongs to a non-volatile memory device (Non-volatile Memory Device). It is based on a floating gate transistor design, and charges a...
2024-03-29
Macronix offers an extensive line of 5V and 3V industry-standard Parallel NOR Flash memory products from 2Mb to 1Gb densities. These products feature Boot and Uniform Sector architectures in x8, x1...
2024-03-20
Macronix SLC NAND Flash complements its world-leading Serial and Parallel NOR Flash offerings. Our rigorous quality management system ensures that Macronix SLC NAND is one of the most robust and re...
2024-03-20
As embedded systems evolve, there are many applications with a Serial Peripheral Interface (SPI) that require higher-density memory solutions to store large image files. Recognizing such applicatio...
2024-03-20
Macronix designs and manufactures 3V, 2.5V and 1.8V Serial NOR Flash products from 512Kb to 2Gb. We also offer backward-compatible, high-performance Serial NOR Flash, MXSMIO® (Multi-I/O) family and...
2024-03-20
RAW SLC NAND Flash Memory for OEM & IndustrialSLC: A Reliable, High-Performing ChoiceA 1-bit per cell, non-volatile memory, KIOXIA SLC (single-level cell) NAND flash memory writes large amounts of ...
2024-03-20
Serial Interface NAND Flash Memory for OEM & IndustrialSerial Interface NAND Flash Memory: A High-Speed SPI Alternative to NOR Flash MemoryKIOXIA Serial Interface NAND flash memory features a seria...
2024-03-20
Consumer Grade e-MMC SpecsCapacityPart Numbere-MMC VersionMax Data Rate(MB/s)Supply VoltageOperating Temperature(℃)Package Size(mm)VCC (V)VCCQ (V)4GBTHGBMNG5D1LBAIT5.04002.7 to 3.61.70 to 1.95,2.7 ...
2024-03-20
UFS 4.0 SpecsCapacityPart NumberUFSVersionMax DataRate(MB/s)Supply VoltageOperatingTemperature(℃)Package Size(mm)VCC(V)VCCQ(V)VCCQ2(V)128GBTHGJFJT0E25BAIP4.046402.4 to 2.71.14 to 1.26- (1)-25 to 85...
2024-03-20
CapacityPart NumberUFSVersionMax DataRate(MB/s)Supply VoltageOperatingTemperature(℃)Package Size(mm)VCC(V)VCCQ(V)VCCQ2(V)32GBTHGAF8G8T23BAIL2.111602.7 to 3.6- (1)1.70 to 1.95-25 to 8511.5x13.0x0.86...
2024-03-20
Rayson Technology Ltd.RAYSON HI-TECH(SZ) LIMITED was founded in 2016. It is a high-tech enterprise of memory chip integrated with design, research & development, package, testing and marketing.Head...
2024-03-19
RaysonDDR4Package:FBGA 96bDensity:2Gbit~8GbitOperating Temperature Range:0~85℃Speed:2400Mbps/2667MbpsVoltage:1.2VApproved Verification Platform:MTK、Spreadtrum、Rockchip、Amlogic● Speed up to 2667Mbps...
2024-03-19
RaysonDDR3Package:FBGA 96bDensity:128*16/256*16/512*16Operating Temperature Range:0~85℃Speed:1866MbpsVoltage:1.35 / 1.5 VApproved Verification Platform:MTK、Spreadtrum、Rockchip、Amlogic● Higher exter...
2024-03-19
RaysonLPDDR4/4XPackage:FBGA 200bDensity:4Gbit~64GbitOperating Temperature Range:-25~85℃Speed:2667Mbps/3200Mbps/3733MbpsVoltage:VDD1/VDD2/VDDQ= 1.8 / 1.1 / 1.1 V(LPDDR4)VDD1/VDD2/VDDQ = 1.8 / 1.1 / ...
2024-03-19
MT40A8G4CLU-062H:Edownload32Gb95CTFBGADDR4 SDRAMMT40A2G4SA-062E:Rdownload8Gb0C to +95CTFBGADDR4 SDRAMMT40A4G4VA-062E:Bdownload16Gb0C to +95CTFBGADDR4 SDRAMMT40A1G8SA-062E AAT:Edownload8Gb-40C to +1...
2024-03-19
MT62F3G32D8DV-026 AAT:Bdownload98Gb3750MHz-40C to +105C3G X32LFBGALPDDR5MT62F1G32D2DS-020 WT:Cdownload32Gb4800MHz-25C to +85C1G X32TFBGALPDDR5MT62F512M64D4EK-031 IT:Bdownload32Gb3200MHz-40C to +95C...
2024-03-19
Part No.NAND ModeDRAM ModeNAND DensityDRAM DensityProduct StatusH9HP52AECMMDAR-KMMeMMC5.1LPDDR4X64GB6GBMPH9HP53AECMMDAR-KMMeMMC5.1LPDDR4X64GB6GBMPH9AG9G5ANBX100eMMC5.1LPDDR4X64GB4GBMPH9HP52ACPMADAR...
2024-03-19
Part No.NAND ModeDRAM ModeNAND DensityDRAM DensityProduct StatusH9HQ54AECMMDAR-KEMUFS2.2LPDDR4X64GB6GBMPH9HQ54ACPMMDAR-KEMUFS2.2LPDDR4X64GB4GBMPH9HQ54ADKMMDAR-KEMUFS2.2LPDDR4X64GB3GBCSH9HQ53AECMMDA...
2024-03-19
table for product spec finderPart No.Model NameDensityProduct GradeTemperatureVoltage(VCC/VCCQ)PKG TypeProduct StatusH26M78208CMRNEE510A64GBCT-25~85C3.3V / 1.8VFBGAMPH26M78208CMRIEE510A64GBIT-40~85...
2024-03-19
Part No.Model NameDensityMono-DensityPKG SizePKG TypeSpecVoltage(VCC/VCCQ)Product StatusHN8T25BZGKX017NUC310512GB512Gb11.5x13x1.0mmFBGAUFS 3.12.5V / 1.2VMPHN8T15BZGKX016NUC310256GB512Gb11.5x13x1.0m...
2024-03-19
|